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Quantum Sensing Moves Towards a Real Semiconductor Roadmap

Erlangen, December 10, 2025


The recent Quantum Sensing Workshop in Erlangen offered a clear message: quantum

sensing is likely to become the first quantum technology to reach real-world markets. In

contrast to quantum computing or quantum communication, quantum sensing technologies are significantly closer to being engineered into robust, certifiable and commercially viable systems.


The workshop was jointly organised by Katrin Al Jezany and Reiner John (AVL List GmbH),

together with Prof. Dr.-Ing. Roland Nagy from the Institute of Applied Quantum Technologies

at FAU Erlangen-Nürnberg, within the framework of the Chips Joint Undertaking co-funded

projects A-IQ Ready, ARCHIMEDES and Cynergy4MIE. Representatives from these

initiatives, along with partners from the MOSAIC project, presented progress across the

entire chain of applications within the Chips JU programme.


A key takeaway emerged across all discussions: quantum sensing has evolved from a topic

of fundamental physics into a semiconductor-driven and systems-oriented discipline.

Bridging the gap between laboratory prototypes and real industrial products requires the convergence of five essential semiconductor building blocks:


  • Photonics – integrated optics for excitation, readout and signal routing;

  • Wide-bandgap technologies – particularly diamond and SiC as robust sensor and

    power platforms;

  • Digital CMOS – enabling control, calibration and safe system integration;

  • High-precision analogue and mixed-signal front-ends – essential for capturing ultra-

    weak quantum signals;

  • Hybrid, heterogeneous package integration – combining photonics, wide-bandgap,

    digital and analogue components into industrial-grade modules;


With focused investment, quantum sensing could unlock more than €1 billion in impact in

defence, medicine and automotive applications, strengthening Europe’s position at the

intersection of semiconductor and quantum technologies.



The Importance of Clustering Between A-IQ Ready, ARCHIMEDES and Cynergy4MIE


The workshop also highlighted the strategic significance of the clustering activities between

the A-IQ Ready, ARCHIMEDES and Cynergy4MIE projects. By aligning technical roadmaps,

sharing engineering insights and coordinating research activities, the three initiatives are

accelerating progress beyond what any individual project could achieve alone. This

clustering enables a unified approach to semiconductor, photonic and system-level

challenges, ensures coherence across the full TRL chain, and strengthens Europe’s

collective capacity to bring portable quantum sensors to market. The collaboration also

provides a platform for partners to demonstrate advancements, exchange expertise, and

align future development goals.


During the Quantum Sensor Workshop 2025, partners from A-IQ Ready, ARCHIMEDES and

Cynergy4MIE showcased the significant progress made over the past year. AVL, Infineon

Technologies, Mercedes-Benz AG, Renault Group, Valeo, ZF Group, NXP Semiconductors,

STMicroelectronics, TTTech Auto, Silicon Austria Labs, EDI – Institute of Electronics and

Computer Science, Nagy Lab for Applied Quantum Technologies and Virtual Vehicle

Research GmbH, have demonstrated the crucial role these projects play in the development

of a portable quantum sensor.



Applications Demonstrated


The workshop highlighted several concrete application areas, including:

  • Quantum sensor integration in battery management systems;

  • A search and rescue robot equipped with a quantum sensor;

  • Quantum sensors for measurements in electric motors;

  • Quantum sensor for the measurement of superparamagnetic nanoparticles in

    biomedical applications presented by Prof. Dr. rer. nat. Dr. habil. med. Stefan Lyer.



Key Achievements Compared with Last Year


  • Complete portability of the measurement setup, enabling on-site measurements at

    partner locations;

  • Realisation of a miniaturised sensor head;

  • Significant improvements in magnetic-field sensitivity;

  • Continued exploration of new application domains.


The three project consortia will continue to support this momentum through the Quantum

Sensor Working Group, which aims to map the five technology pillars into Chips JU

roadmaps, align funding instruments across the Technology Readiness Level chain, and

prepare the next wave of projects for industrial deployment.


Special gratitude was expressed to the organisers - Reiner John, Katrin Al Jezany, Roland

Nagy, Rihards Novickis - and to all participants for their contributions and active knowledge

exchange. Particular appreciation was extended to the Nagy Lab for Applied Quantum

Technologies for hosting the visit to the FAU quantum sensing laboratory.


ACKNOWLEDGMENTS: A-IQ READY is supported by the Chips Joint Undertaking and its

members, including the top-up funding by National Authorities under Grant Agreement No

101096658. ARCHIMEDES is supported by the Chips Joint Undertaking and its members,

including the top-up funding by National Authorities  under Grant Agreement No 101112295.

Cynergy4MIE is supported by the Chips Joint Undertaking and its members, including the

top-up funding by National Authorities under Grant Agreement No 101140226.


Funded by the European Union. Views and opinions expressed are however those of the

author(s) only and do not necessarily reflect those of the European Union or the granting

authority. Neither the European Union nor the granting authority can be held responsible for

them.


Quantum Sensing Moves Towards a Real Semiconductor Roadmap

 
 
Co-funded by the European Union logo

Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.

ACKNOWLEDGMENT: ARCHIMEDES is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities  under Grant Agreement No 101112295.

© 2025 by ARCHIMEDES Consortium

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