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ARCHIMEDES Presented at ECCE Asia 2025 in Bengaluru, India

From May 11 to 14, 2025, the ARCHIMEDES project was prominently featured at the prestigious ECCE Asia 2025 conference, held in Bengaluru, India. Organised by the IEEE Power Electronics Society (PELS), the event brought together leading researchers, industry experts, and academics from across the globe to explore the latest advancements in power electronics.


Bengaluru, often hailed as the “Silicon Valley of India,” served as a fitting backdrop for the conference. As the country’s premier technology hub, the city is home to a vibrant ecosystem of startups, tech firms, research labs, and academic institutions, providing an ideal environment for innovation and collaboration.


Now in its 16th year, ECCE Asia has solidified its position as a premier conference in the field of power electronics. This year’s edition offered a rich program that included high-profile technical presentations, industry exhibitions, networking events, and technical tours. These activities fostered dynamic discussions and interdisciplinary collaboration aimed at advancing global research and development.


ARCHIMEDES was showcased through a conference paper titled “Robustness Analysis of Temperature-Sensitive Electrical Parameters of SiC MOSFETs.”


Participation in ECCE Asia 2025 provided an invaluable platform for the ARCHIMEDES team to engage with international experts, exchange ideas, and explore potential synergies.


ARCHIMEDES Presented at ECCE Asia 2025 in Bengaluru, India

 
 
Co-funded by the European Union logo

Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.

ACKNOWLEDGMENT: ARCHIMEDES is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities  under Grant Agreement No 101112295.

© 2025 by ARCHIMEDES Consortium

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