ARCHIMEDES Final General Assembly Paris 2026
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On the 11th and the 12th of May 2026, the ARCHIMEDES consortium gathered in Paris for its Final General Assembly, bringing together partners from across Europe for a constructive, productive, and inspiring meeting focused on the future of power electronics and European collaboration. Hosted by NextMove, the event welcomed 72 participants from 10 European countries to address key strategic challenges in the sector and strengthen cooperation across the European innovation ecosystem.
The General Assembly featured several highlights, including a visit to the power electronics laboratory at Université Gustave Eiffel, offering participants insights into ongoing research and technological developments. Consortium members also shared updates on the project’s Work Packages, Supply Chains, and Demonstrators, providing an overview of progress achieved throughout the initiative.
A dedicated roundtable discussion explored synergies between the IPCEI ME/CT and Chips Joint Undertaking initiatives. The session included contributions from representatives of STMicroelectronics, Schaeffler, Renault Group, and Valeo, fostering dialogue on collaboration opportunities across Europe’s semiconductor and mobility industries.
The meeting also included an exploitation workshop focused on plans for the use and deployment of ARCHIMEDES project results, supporting the initiative’s long-term impact and future implementation efforts.
